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Globalising Intellectual Property: The TRIPS Agreement
D. Matthews Manufacturer: Routledge ProductGroup: Book Binding: Paperback ASIN: 0415406587 |
Book Description
In Globalising Intellectual Property Rights, Matthews looks at the various aspects of the agenda-setting, legal interpretation, implementation, enforcement and revision of the TRIPS Agreement (Trade-Related Aspects of Intellectual Property Rights, including Trade in Counterfeit Goods) from the viewpoint of global business interests and from the perspective of developing countries. This book will be of interest to students and researchers in the fields of international relations, intellectual property law, international economic law and development studies.
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Globalising Intellectual Property Rights: The TRIPs Agreement.(Book Review): An article from: Journal of Economic Issues
Richard V. Adkisson Manufacturer: Association for Evolutionary Economics ProductGroup: Book Binding: Digital ASIN: B0008DK8HY Release Date: 2005-07-31 |
Book Description
This digital document is an article from Journal of Economic Issues, published by Association for Evolutionary Economics on September 1, 2003. The length of the article is 735 words. The page length shown above is based on a typical 300-word page. The article is delivered in HTML format and is available in your Amazon.com Digital Locker immediately after purchase. You can view it with any web browser.
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The Infinite Resource: Creating and Leading the Knowledge Enterprise (Jossey Bass Business and Management Series)
Manufacturer: Jossey-Bass ProductGroup: Book Binding: Hardcover Similar Items: ASIN: 0787910155 |
Book Description
Harness the Boundless Power of KnowledgeTake a fascinating glimpse into the not-too-distant future. In The Infinite Resource, seventeen visionary thinkers explore knowledge--the only inexhaustible source of competitive advantage--as the juggernaut of an remarkable new order whose advent is fast rAndering today's business conventions obsolete. Their incisive observations include up-to-the-minute examinations of knowledge-change initiatives currently under way at Bell Atlantic, MCI, Lufthansa, and other forward-thinking companies. Filled with fresh ideas, perspectives, and voices, it's a state-of-the-art appraisal of emerging organizational forms vital to anyone grappling with the challenges and possibilities posed by the Information Age.
Customer Reviews:
Passages from Control to Entrepreneurial Freedom........2001-01-22
Principle 1: 'Complexity Is Managed Through Freedom': Success is no longer achieved by planning and control-but through entrepreneurial freedom among people at the bottom.
Principle 2: 'Cooperation Is Economically Efficient': Economic strength does not come from power and firmness-but out of the cooperative flow of information within a corporate community.
Principle 3: 'Progress Is Guided by Knowledge and Spirit': Abundance is not the result of material riches-but of understanding the subtle workings of an infinitely complex world.
There are the new laws governing institutions today, the economic imperatives that determine who succeeds and who fails, the keys to pioneering an unexplored frontier of boundless knowledge-The Infinite Resource" (from the Introduction).
In this context, Halal organizes this invaluable collection into three parts that each focuses on the principles outlined as below:
1. Halal writes, "Part I shows that today's hierarchical structures are being replaced by an emerging foundation of management based on enterprise. The complexity of a knowledge era has made our old command-and-control systems obsolete, and so entrepreneurial freedom is now crucial, not only in economic systems but also to permit free enterprise in organizational systems." Thus, authors of this part, S.Goldsmith, R.L.Ackoff, J.P.Starr, W.Gable, and M.Lehrer mainly focus on decentralized structures, self-supporting units, entrepreneurial freedom, internal competition, and accountability to clients.
2. Halal writes, "Part II illustrates how entrepreneurial organizations must also use cooperation to form collaborative communities. Knowledge differs from physical resources because it increases when shared, making collaborative working relations productive not only in strategic alliances but between buyer and seller, employee and employer, business and goverment, and other stakeholders." Thus, authors of this part, G.H.Taylor, R.E.Miles, J.Lipnack and J.Stamps, T.Holbrooke, and R.Oklewize mainly focus on virtues of teamwork, networking among internal units, shared knowledge, spherical organization, collaborative alliances, and corporate communities.
3. Halal writes, "Part III descibes the intelligent infrastructures now being built to guide this corporate community in creating powerful forms of knowledge." Thus, authors of this part, R.W.Smith, D.Walters, M.Malone, G. and E.Pinchot, R.Kuperman, and W.A.Owens mainly focus on global information networks, free flow of information, knowledge society, employee training, virtual organizations, strategic direction, and vision.
Finally, Halal writes that "the message my colleagues and I want to stress is that the world is entering such an uncharted new frontier, an epoch so fundamentally different that the old rules no longer apply. The conventional wisdom of the past must be replaced by concepts that conform with the new realities of infinite knowledge:
* Order can be best achieved-not through control and planning-but through entrepreneurial freedom.
* Strength comes-not out of power and firmness-but through cooperative community.
* Abundance flows out of-not material riches-but a subtle frontier of boundless understanding, meaning, and spirit."
Strongly recommended.
Excellent Multi-disciplinarian Approach.......1999-12-09
Excellent Multi-displinarian Approach.......1999-12-09
Enjoyable and informative collection of thoughtful writings........1999-03-21
An Invaluable Guide to the Coming Knowledge Economy.......1998-09-26
It was, then, inevitable that the extraordinary advances in - and ubiquitous distribution of - information technology would in turn revolutionize the workplace. Dr. Halal breaks the presentations of his conferees into three sections: 1.) Creating the Internal Enterprise System; 2.) Forming a Network of Cooperative Alliances; 3.) Leveraging Knowledge with an Intelligent Infrastructure. The innumerable insights offered by Dr. Halal and his conferees would never fit in this review. Suffice it to say that the most successful organizations today long ago recognized that information technology created opportunities to broadly disseminate organizational information on the one hand and the more elusive [and hence invaluable] "tacit" or personal knowledge of their employees throughout their organizations, conferring upon all employees the ability to leverage all available organizational knowledge into innovations benefiting the organization, its employees, and its consumers. This leads the trend toward cutting-edge "mass customization." But it does not stop there. No sooner did organizations realize that they could unleash the power of knowledge internally than some recognized that the sharing of knowledge could greatly enhance relationships with customers, suppliers, and, yes, competitors which could be leveraged via coopetition - strategic alliances established to meet particular needs of individual clients at any one point in time. For decades, the rise of technology has created nightmarish visions of "1984" and HAL of "2001." Ironically, and perhaps - at first - counterintuitively, advances in information technology, by enhancing access of anyone in any organization with anyone else, anywhere, will make trust all the more important in public and private enterprises alike. Several conferees address the critical importance of disseminating all available information to employees to encourage innovation because, in fact, "the innovation cycle is now shorter than the planning cycle as customers are moving faster than companies' ability to manage." In short, if you cannot entrust your employees with your most sensitive information, you will be overtaken by another company that can. Another conferee notes: "Technology alone is inert. Trust develops and relationships crystallize in interactions over time and in moments of crisis. No trust without real relationships. No network without trust." It might, therefore, be one of the greatest ironies of the coming Knowledge Economy that technology will "re-personalize" relationships in the workplace while allowing all workers increased opportunities to make their own measurable [and thus rewardable] contributions to their organizations and alliances. Technology, as a tool, will free organizations and their employees from the more mundane business and governmental functions of measurement to engage their minds, individually and collectively, on an infinite course of creativity and innovation. Some provocative closing thoughts from this excellent book include the following insights from leaders of our continuing Knowledge Revolution: Bill Gates: "Two years is as far as long-term planning should go; anything beyond that is long-range dreaming..." General Electric: "The only way to be more competitive is to engage every mind in the organization." Ad agency Chiat Day: "Develop the ability to change faster than your competition or fail..." Dr. Halal: "The perfect company today is almost structureless. All that holds it together is its culture.
I cannot more highly recommend The Infinite Resource to all who are interested in understanding the enormous challenges, opportunities, and rewards - both personal and professional - to be realized as the Knowledge Economy reshapes our world.
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The Infinite Resource: Creating and Leading the Knowledge Enterprise.: An article from: The Futurist
Manufacturer: World Future Society ProductGroup: Book Binding: Digital ASIN: B00098979I Release Date: 2005-07-28 |
Book Description
This digital document is an article from The Futurist, published by World Future Society on August 1, 1998. The length of the article is 473 words. The page length shown above is based on a typical 300-word page. The article is delivered in HTML format and is available in your Amazon.com Digital Locker immediately after purchase. You can view it with any web browser.
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Case Gp Tractors (Motorbooks International Farm Tractor Color History)
Robert N. Pripps , and Andrew Morland Manufacturer: Motorbooks International ProductGroup: Book Binding: Paperback ASIN: 0760301166 |
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Reliability & Failure of Electronic Materials & Devices
Milton Ohring Manufacturer: Academic Press ProductGroup: Book Binding: Hardcover Similar Items:
ASIN: 0125249853 |
Book Description
Suitable as a reference work for reliability professionals or as a text for advanced undergraduate or graduate students, this book introduces the reader to the widely dispersed reliability literature of microelectronic and electronic-optional devices. Reliability and Failure of Electronic Materials and Devices integrates a treatment of chip and packaging level failures within the context of the atomic mechanisms and models used to explain degradation, and the statistical handling of lifetime data. Electromigration, dielectric radiation damage and the mechanical failure of contacts and solder joints are among the failure mechanisms considered. An underlying thread of the book concerns product defects--their relation to yield and reliability, the role they play in failure, and the way they are experimentally exposed.Customer Reviews:
Reliability & Failure of Electronic Materials & Devices .......2006-03-03
A true textbook, rather than a handbook, on reliability.......2002-04-05
Highly Recommendable.......2000-09-05
I would recommend it as a textbook as well as for the experienced scientist/researcher.
Excellent review on device reliability and failure analysis.......1999-04-18
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Influence of Temperature on Microelectronics and System Reliability: A Physics of Failure Approach (Electronic Packaging Series)
Pradeep Lall , Michael Pecht , and Edward B. Hakim Manufacturer: CRC ProductGroup: Book Binding: Hardcover Similar Items:
ASIN: 0849394503 |
Book Description
This book raises the level of understanding of thermal design criteria. It provides the design team with sufficient knowledge to help them evaluate device architecture trade-offs and the effects of operating temperatures. The author provides readers a sound scientific basis for system operation at realistic steady state temperatures without reliability penalties. Higher temperature performance than is commonly recommended is shown to be cost effective in production for life cycle costs.The microelectronic package considered in the book is assumed to consist of a semiconductor device with first-level interconnects that may be wirebonds, flip-chip, or tape automated bonds; die attach; substrate; substrate attach; case; lid; lid seal; and lead seal. The temperature effects on electrical parameters of both bipolar and MOSFET devices are discussed, and models quantifying the temperature effects on package elements are identified. Temperature-related models have been used to derive derating criteria for determining the maximum and minimum allowable temperature stresses for a given microelectronic package architecture.The first chapter outlines problems with some of the current modeling strategies. The next two chapters present microelectronic device failure mechanisms in terms of their dependence on steady state temperature, temperature cycle, temperature gradient, and rate of change of temperature at the chip and package level. Physics-of-failure based models used to characterize these failure mechanisms are identified and the variabilities in temperature dependence of each of the failure mechanisms are characterized. Chapters 4 and 5 describe the effects of temperature on the performance characteristics of MOS and bipolar devices. Chapter 6 discusses using high-temperature stress screens, including burn-in, for high-reliability applications. The burn-in conditions used by some manufacturers are examined and a physics-of-failure approach is described. The final chapter overviews existing guidelines for thermal derating of microelectronic devices, which presently involve lowering the junction temperature. The reader then learns how to use physics-of-failure models presented in the previous chapters for various failure processes, to evaluate the sensitivity of device life to variations in manufacturing defects, device architecture, temperature, and non-temperature stresses.
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Failure Mechanisms in Semiconductor Devices
E. Ajith Amerasekera , and Farid N. Najm Manufacturer: Wiley ProductGroup: Book Binding: Hardcover Similar Items:
ASIN: 0471954829 |
Book Description
Failure Mechanisms in Semiconductor Devices Second Edition E. Ajith Amerasekera Texas Instruments Inc., Dallas, USA Farid N. Najm University of Illinois at Urbana-Champaign, USA Since the successful first edition of Failure Mechanisms in Semiconductor Devices, semiconductor technology has become increasingly important. The high complexity of today's integrated circuits has engendered a demand for greater component reliability. Reflecting the need for guaranteed performance in consumer applications, this thoroughly updated edition includes more detailed material on reliability modelling and prediction. The book analyses the main failure mechanisms in terms of cause, effects and prevention and explains the mathematics behind reliability analysis. The authors detail methodologies for the identification of failures and describe the approaches for building reliability into semiconductor devices. Their thorough yet accessible text covers the physics of failure mechanisms from the semiconductor die itself to the packaging and interconnections. Incorporating recent advances, this comprehensive survey of semiconductor reliability will be an asset to both engineers and graduate students in the field.
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Proceedings of the 13th European Symposium on the Reliability of Electron Devices, Failure Physics and Analysis
F. Fantini , and M. Vanzi Manufacturer: Pergamon ProductGroup: Book Binding: CD-ROM ASIN: 0080441815 |
Book Description
This Proceedings contains the papers presented at the 13th European Symposium on the Reliability of Electron Devices, Failure Physics and Analysis (ESREF 2002), held in Bellaria, Italy, 7-11 Oct 2002. The Proceedings are being published concurrently as a special issue of
Since its foundation in 1990, the annual ESREF symposium has been the premier European forum for the discussion of research in all aspects of specification, technology and manufacturing, test, control and analysis for microelectronic devices and circuits. Researchers at top institutions, in Europe and elsewhere, present high-quality experimental results at ESREF. The ESREF Proceedings have been published by Elsevier Science since 1996.
This year's Proceedings follow the format and style of previous books in the series, and as always the list of topics addressed changes to keep up with developments in the field. Two new topics this year are optical devices and microelectromechanical systems (MEMS); both have attracted a high number of scientific contributions.
The Proceedings contains nine invited papers and approximately 100 submitted contributions on the following topics:
• Quality and reliability techniques for components and system
• Failure mechanisms in silicon devices
• Failure mechanisms in compound semiconductors devices
• Non-volatile and programmable device reliability
• Power devices reliability
• Photonics reliability
• Packaging and assembly reliability
• Advanced failure analysis: defect detection and analysis
• Electron and optical beam testing (EOBT)
• Electrostatic discharge (ESD)
• MEMS/MOEMS (Special Session)
All papers are reviewed prior to publication.
In this, the 40th year of publication of the journal Microelectronics Reliability, two of the invited papers are contributed by senior members of the Journal's Editorial Board, and are dedicated to that anniversary.
This Proceedings will be indispensable for scientists and engineers working on the quality and reliability of microelectronic devices and circuits, and for anyone with a general interest in microelectronics research.
For more information on
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Proceedings of the 1999 7th International Symposium on the Physical & Failure Analysis of Integrated Circuits
Manufacturer: IEEE Standards Office ProductGroup: Book Binding: Paperback ASIN: 0780351878 |
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Reliability of Electronic Components: A Practical Guide to Electronic Systems Manufacturing
Titu I. Bajenescu , and Marius I. Bazu Manufacturer: Springer ProductGroup: Book Binding: Hardcover ASIN: 3540657223 |
Book Description
The objective of this book is to better understand why components fail, addressing the needs of engineers who will apply reliability principles in design, manufacture, testing, and field service. It so contributes to new approaches and the development of electronic and telecommunications component reliability. As a reference source, it summarizes the knowledge on failure modes, degradation and mechanisms, including a survey of accelerated testing, achieving better reliability, total quality topics, screening tests and prediction methods. A detailed index, a glossary, acronym lists, reliability dictionaries and a rich specific bibliography round the benefit offered by the book. The technical level suites to senior and graduate students, as well as to experts and managers in industries.
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Reliability & Failure of Electronic Materials & Devices
Milton Ohring Manufacturer: Academic Press ProductGroup: Book Binding: Paperback ASIN: B000OHM9I0 |
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